Firmware Engineering Intern

About this opportunity

Participate in design and development of key signing infrastructure enhancements. Participate in design and development of product security features using TPM 2.0 security chip

From the employer’s requirements

• Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our...
• Intern Education & Experience Required:
• Familiarity with open-source usage; must understand the concept of code provenance and

Before you apply

• Review the complete requirements and closing date on the employer’s application page.
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